China’s YMTC Introduces Chip With 232 Layers of Memory Cells to Catch Up With Micron, SK Hynix

Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.

Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed to start mass production of its 232 layer chip by the end of the year.Chinese chipmaker Yangtze Memory Technologies Ltd (YMTC) on Wednesday announced new memory chip technology that would help it catch up with rivals Micron and SK Hynix, just as Washington considers steeper curbs on Chinese semiconductor companies. The company unveiled its fourth-generation 3D NAND chip, the X3-9070, and its first to feature 232 layers of memory cells, government-backed media outlet Global Times reported on Wednesday. That places it close to rival Micron, which last month said it aimed